During an e beam evaporation process current is first passed through a tungsten filament which leads to joule heating and electron emission.
Electron beam evaporation system.
Linear e beam sources are also available.
Atc e and atc orion 8e cylindrical uhv style chambers and atc 2030 and atc 2036 hv style box coaters.
E beam evaporation provides for the direct transfer of a larger amount of energy into the source material enabling the evaporation of metal and dielectric materials with very high melting temperatures such as gold and silicon dioxide respectively.
The generated electron beam is accelerated to a high kinetic energy and directed towards the evaporation material.
Electron beam assembly and power supply blue wave integrates the most reliable versatile easy to use and maintain electron beam evaporation source from telemark.
The e beam system has the following features.
Some of these materials include high temperature materials such as gold used as an electrical contact in solar cell applications or ceramics like silicon dioxide for optical films among many others.
Electron beam evaporation or e beam evaporation is a powerful physical vapor deposition process that allows the user to evaporate materials that are difficult or even impossible to process using standard resistive thermal evaporation.
Aja international atc e series electron beam evaporation systems are available in the following versions.
Our evaporation systems come complete with power supplies sweep controls and quartz crystal deposition rate monitors for closed loop feedback control.
Electron beam e beam evaporation is a time tested deposition technology for producing dense high purity coatings.
These systems can contain single or multiple thermal sources multi pocket e beam sources and multi gun sources as required.
Four pockets 4cc for electron beam evaporation no sweep.
E beam evaporation is a physical vapor deposition pvd technique whereby an intense electron beam is generated from a filament and steered via electric and magnetic fields to strike source material e g.
E beam electron beam evaporation is a thermal evaporation process and along with with sputtering is one of the two most common types of physical vapor deposition pvd.
Upon striking the evaporation material the electrons will lose their energy very rapidly.
The electron beam evaporation system is available in two different configurations.
This configuration can be provided with a gate valve between the two chambers to be used as a load lock to keep the e beam source and the evaporation pockets in vacuum while substrates are loaded and unloaded.
A compact vertical dual chamber configuration features a 14 cube main chamber where the platen is located and underneath the main chamber a secondary chamber is provided for housing the e beam source.
The kinetic energy of the electrons is converted into other forms of energy through interactions with the evaporation material.
High voltage is applied between the filament and the hearth to accelerate these liberated electrons towards the crucible containing the material to be deposited.
